LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC3113IFE#TRPBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-17 03:59:22) | TOTAL MASS (g): | 0.079746 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005712 | 1000000 | 71626.96875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.026547 | 975000 | 332892.34375 | ||
| Iron (Fe) | 7439-89-6 | 0.000653 | 24000 | 8188.44775391 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000008 | 300 | 100.317886353 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000019 | 700 | 238.254959106 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.027227 | 1000000 | 341419.375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002940 | 1000000 | 36860.5976562 | ||||
| External Plating Total: | 0.002940 | 1000000 | 36860.5976562 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001123 | 1000000 | 14082.1230469 | ||||
| Internal Plating Total: | 0.001123 | 1000000 | 14082.1230469 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001480 | 750000 | 18558.8085938 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000493 | 250000 | 6182.08984375 | |||||
| Die Attach Total: | 0.001973 | 1000000 | 24740.8964844 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006015 | 150000 | 75426.5078125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.032882 | 820000 | 412331.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001002 | 25000 | 12564.8134766 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000201 | 5000 | 2520.48706055 | ||||
| Encapsulation Total: | 0.040100 | 1000000 | 502843.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000672 | 1000000 | 8426.70117188 | ||
| TOTAL MASS (g): | 0.079746 | |||||||