LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC2983HLX#PBF | (Engineering Calculation) | LQFP 7mm X 7mm | ||||||
| (printed on: 2017-03-16 21:49:59) | TOTAL MASS (g): | 0.139526 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000851 | 1000000 | 6099.22753906 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.048877 | 975000 | 350307.78125 | ||
| Iron (Fe) | 7439-89-6 | 0.001203 | 24000 | 8622.05664062 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000015 | 300 | 107.50693512 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000035 | 700 | 250.849517822 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.050130 | 1000000 | 359288.1875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005224 | 1000000 | 37440.3007812 | ||||
| External Plating Total: | 0.005224 | 1000000 | 37440.3007812 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.005200 | 1000000 | 37269.0742188 | ||||
| Internal Plating Total: | 0.005200 | 1000000 | 37269.0742188 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000409 | 750000 | 2931.35595703 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000136 | 250000 | 974.729614258 | |||||
| Die Attach Total: | 0.000545 | 1000000 | 3906.08569336 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.007929 | 103000 | 56828.171875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.068897 | 895000 | 493793.71875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000154 | 2000 | 1103.73791504 | ||||
| Encapsulation Total: | 0.076980 | 1000000 | 551725.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000596 | 1000000 | 4271.609375 | ||
| TOTAL MASS (g): | 0.139526 | |||||||