LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC2977CUP#PBF | (Engineering Calculation) | QFN 9mm X 9mm Exp. Pad | ||||||
| (printed on: 2017-03-16 22:28:20) | TOTAL MASS (g): | 0.224134 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005155 | 1000000 | 22999.6054688 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.104491 | 975000 | 466198.21875 | ||
| Iron (Fe) | 7439-89-6 | 0.002572 | 24000 | 11475.2636719 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000032 | 300 | 142.771560669 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000075 | 700 | 334.620849609 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.107170 | 1000000 | 478150.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003192 | 1000000 | 14242.6767578 | ||||
| External Plating Total: | 0.003192 | 1000000 | 14242.6767578 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002279 | 1000000 | 10168.0117188 | ||||
| Internal Plating Total: | 0.002279 | 1000000 | 10168.0117188 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001777 | 750000 | 7928.28271484 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000592 | 250000 | 2641.27392578 | |||||
| Die Attach Total: | 0.002369 | 1000000 | 10569.5576172 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.013460 | 130000 | 60053.2851562 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.089044 | 860000 | 397279.6875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001035 | 10000 | 4617.76757812 | ||||
| Encapsulation Total: | 0.103539 | 1000000 | 461950.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000430 | 1000000 | 1918.49267578 | ||
| TOTAL MASS (g): | 0.224134 | |||||||