LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC2965CMS#TRPBF | (Engineering Calculation) | MSOP | ||||||
| (printed on: 2017-03-16 20:25:51) | TOTAL MASS (g): | 0.036154 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001460 | 1000000 | 40382.78125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.013845 | 975000 | 382944.9375 | ||
| Iron (Fe) | 7439-89-6 | 0.000355 | 25000 | 9819.10058594 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 300 | 110.637756348 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000010 | 700 | 276.594360352 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.014214 | 1001000 | 393151.25 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000710 | 1000000 | 19638.8925781 | ||||
| External Plating Total: | 0.000710 | 1000000 | 19638.8925781 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 2378.71166992 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 2378.71166992 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000558 | 750000 | 15433.9658203 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000186 | 250000 | 5144.65576172 | |||||
| Die Attach Total: | 0.000744 | 1000000 | 20578.6230469 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002439 | 130000 | 67461.375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.015571 | 830000 | 430685.09375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000657 | 35000 | 18172.2519531 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000094 | 5000 | 2599.98730469 | ||||
| Encapsulation Total: | 0.018761 | 1000000 | 518918.6875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000179 | 1000000 | 4951.03955078 | ||
| TOTAL MASS (g): | 0.036154 | |||||||