LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC2933CDHD#PBF | (Engineering Calculation) | DFN 5mm X 4mm Exp. Pad | ||||||
| (printed on: 2017-03-16 17:41:56) | TOTAL MASS (g): | 0.053858 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002879 | 1000000 | 53455.6484375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023117 | 975000 | 429223.40625 | ||
| Iron (Fe) | 7439-89-6 | 0.000569 | 24000 | 10564.8710938 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000007 | 300 | 129.972061157 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000017 | 700 | 315.64642334 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.023710 | 1000000 | 440233.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001124 | 1000000 | 20864.8378906 | ||||
| External Plating Total: | 0.001124 | 1000000 | 20864.8378906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000522 | 1000000 | 9692.20214844 | ||||
| Internal Plating Total: | 0.000522 | 1000000 | 9692.20214844 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001184 | 750000 | 21983.8457031 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000395 | 250000 | 7334.13720703 | |||||
| Die Attach Total: | 0.001579 | 1000000 | 29317.9824219 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.003117 | 130000 | 57874.6992188 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.020623 | 860000 | 382916.25 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000240 | 10000 | 4456.18457031 | ||||
| Encapsulation Total: | 0.023980 | 1000000 | 445247.09375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000064 | 1000000 | 1188.31591797 | ||
| TOTAL MASS (g): | 0.053858 | |||||||