LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC2926CUFD#PBF | (Engineering Calculation) | QFN 4mm X 5mm Exp. Pad | ||||||
| (printed on: 2017-03-17 02:40:16) | TOTAL MASS (g): | 0.050516 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002554 | 1000000 | 50558.03125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.019997 | 975000 | 395853.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.000492 | 24000 | 9739.44921875 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 300 | 118.773765564 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000014 | 700 | 277.138793945 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.020509 | 1000000 | 405988.53125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000227 | 1000000 | 4497.72460938 | ||||
| External Plating Total: | 0.000227 | 1000000 | 4497.72460938 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000498 | 1000000 | 9858.22265625 | ||||
| Internal Plating Total: | 0.000498 | 1000000 | 9858.22265625 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001080 | 750000 | 21379.2773438 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000360 | 250000 | 7126.42578125 | |||||
| Die Attach Total: | 0.001440 | 1000000 | 28505.703125 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.002745 | 110000 | 54338.9960938 | |||
| Bromine (Br) | 40039-93-8 | 0.000250 | 10000 | 4948.90722656 | ||||
| Silica (SiO2) | 60676-86-0 | 0.021208 | 850000 | 419825.65625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000749 | 30000 | 14826.9248047 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.024952 | 1000000 | 493940.5 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000336 | 1000000 | 6651.33056641 | ||
| TOTAL MASS (g): | 0.050516 | |||||||