LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC2911HTS8-4#TRPBF | (Engineering Calculation) | TSOT-23 | ||||||
| (printed on: 2017-03-16 19:49:31) | TOTAL MASS (g): | 0.012305 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000684 | 1000000 | 55588.5585938 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.004582 | 975000 | 372378.3125 | ||
| Iron (Fe) | 7439-89-6 | 0.000113 | 24000 | 9183.48925781 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 81.269821167 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000003 | 700 | 243.809463501 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.004699 | 1000000 | 381886.90625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000663 | 1000000 | 53856.6914062 | ||||
| External Plating Total: | 0.000663 | 1000000 | 53856.6914062 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000080 | 1000000 | 6501.58544922 | ||||
| Internal Plating Total: | 0.000080 | 1000000 | 6501.58544922 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000011 | 100000 | 893.968017578 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000033 | 300000 | 2681.90405273 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000066 | 600000 | 5363.80810547 | |||||
| Die Attach Total: | 0.000110 | 1000000 | 8939.68066406 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000347 | 58000 | 28200.6269531 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.005322 | 890000 | 432517.96875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000299 | 50000 | 24299.6777344 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000012 | 2000 | 975.237854004 | ||||
| Encapsulation Total: | 0.005980 | 1000000 | 485993.5 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000089 | 1000000 | 7233.01367188 | ||
| TOTAL MASS (g): | 0.012305 | |||||||