LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2876CDD#PBF (Engineering Calculation) DFN 3mm X 3mm Exp. Pad  
(printed on: 2017-03-16 20:53:52) TOTAL MASS (g): 0.022756
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001136 1000000 49920.078125
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.009350 975000 410873.875
Iron (Fe) 7439-89-6 0.000230 24000 10107.0576172
Phosphorus (P) 7723-14-0 0.000003 300 131.831192017
Zinc (Zn) 7440-66-6 0.000007 700 307.606109619
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.009590 1000000 421420.375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000437 1000000 19219.9042969
External Plating Total: 0.000437 1000000 19219.9042969
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000218 1000000 9579.73339844
Internal Plating Total: 0.000218 1000000 9579.73339844
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000617 750000 27113.28125
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000206 250000 9052.40820312
Die Attach Total: 0.000823 1000000 36165.6875
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001368 130000 60115.0234375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.009047 860000 397558.90625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000105 10000 4614.09130859
Encapsulation Total: 0.010520 1000000 462288.03125
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000032 1000000 1406.19934082
  TOTAL MASS (g): 0.022756