LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC2757AILX#PBF | (Engineering Calculation) | LQFP 7mm X 7mm | ||||||
| (printed on: 2017-03-16 19:21:58) | TOTAL MASS (g): | 0.197956 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.006180 | 1000000 | 31219.0136719 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.042592 | 693000 | 215158.609375 | ||
| Iron (Fe) | 7439-89-6 | 0.000651 | 10599.9990234 | 3288.60473633 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000602 | 9800 | 3041.07519531 | ||||
| Nickel (Ni) | 7440-02-0 | 0.013288 | 216200.015625 | 67125.921875 | ||||
| Silicon (Si) | 7440-21-3 | 0.000369 | 6000 | 1864.04772949 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.001561 | 25400 | 7885.57910156 | ||||
| Tin (Sn) | 7440-31-5 | 0.002397 | 39000 | 12108.7333984 | ||||
| Lead Frame Total: | 0.061460 | 1000000 | 310472.5625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002712 | 1000000 | 13701.4863281 | ||||
| External Plating Total: | 0.002712 | 1149333 | 13701.4863281 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001274 | 1000000 | 6435.76416016 | ||||
| Internal Plating Total: | 0.001274 | 1000000 | 6435.76416016 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000641 | 750000 | 3238.08837891 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000214 | 250000 | 1081.04675293 | |||||
| Die Attach Total: | 0.000855 | 1000000 | 4319.13525391 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.015015 | 123000 | 75850.078125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.106689 | 874000 | 538952.3125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000366 | 3000 | 1848.89294434 | ||||
| Encapsulation Total: | 0.122070 | 1000000 | 616651.3125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.001008 | 1000000 | 5092.03320312 | ||
| TOTAL MASS (g): | 0.197956 | |||||||