LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC2393HLX-16#PBF | (Engineering Calculation) | QFN 7mm X 7mm Exp. Pad | ||||||
| (printed on: 2017-03-17 07:49:22) | TOTAL MASS (g): | 0.128475 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002780 | 1000000 | 21638.4414062 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.057847 | 975000 | 450258.625 | ||
| Iron (Fe) | 7439-89-6 | 0.001424 | 24000 | 11083.8632812 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000018 | 300 | 140.105026245 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000042 | 700 | 326.911712646 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.059331 | 1000000 | 461809.5 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002894 | 1000000 | 22526.2539062 | ||||
| External Plating Total: | 0.002894 | 1000000 | 22526.2539062 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001274 | 1000000 | 9916.32226562 | ||||
| Internal Plating Total: | 0.001274 | 1000000 | 9916.32226562 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001135 | 750000 | 8834.40039062 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000378 | 250000 | 2942.20532227 | |||||
| Die Attach Total: | 0.001513 | 1000000 | 11776.6044922 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.007847 | 130000 | 61078.0039062 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.051910 | 860000 | 404047.3125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000604 | 10000 | 4701.30175781 | ||||
| Encapsulation Total: | 0.060361 | 1000000 | 469826.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000322 | 1000000 | 2506.32324219 | ||
| TOTAL MASS (g): | 0.128475 | |||||||