LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC2389CLX-16#PBF | (Engineering Calculation) | LQFP 7mm X 7mm | ||||||
| (printed on: 2017-03-17 07:34:04) | TOTAL MASS (g): | 0.194692 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004583 | 1000000 | 23539.7089844 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.042592 | 693000 | 218765.71875 | ||
| Iron (Fe) | 7439-89-6 | 0.000651 | 10599.9990234 | 3343.73803711 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000602 | 9800 | 3092.05834961 | ||||
| Nickel (Ni) | 7440-02-0 | 0.013288 | 216200.015625 | 68251.28125 | ||||
| Silicon (Si) | 7440-21-3 | 0.000369 | 6000 | 1895.29833984 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.001561 | 25400 | 8017.78027344 | ||||
| Tin (Sn) | 7440-31-5 | 0.002397 | 39000 | 12311.7353516 | ||||
| Lead Frame Total: | 0.061460 | 1000000 | 315677.625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002712 | 1000000 | 13931.1894531 | ||||
| External Plating Total: | 0.002712 | 1000000 | 13931.1894531 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001274 | 1000000 | 6543.65917969 | ||||
| Internal Plating Total: | 0.001274 | 1000000 | 6543.65917969 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001213 | 750000 | 6230.34423828 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000404 | 250000 | 2075.0690918 | |||||
| Die Attach Total: | 0.001617 | 1000000 | 8305.41308594 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.016479 | 135000 | 84641.2578125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.104980 | 860000 | 539209.8125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000610 | 5000 | 3133.14916992 | ||||
| Encapsulation Total: | 0.122069 | 1000000 | 626984.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000977 | 1000000 | 5018.17480469 | ||
| TOTAL MASS (g): | 0.194692 | |||||||