LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC2358ILX-16#PBF | (Engineering Calculation) | LQFP 7mm X 7mm | ||||||
| (printed on: 2017-03-16 15:24:27) | TOTAL MASS (g): | 0.192146 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003709 | 1000000 | 19303.0019531 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.042592 | 693000 | 221664.4375 | ||
| Iron (Fe) | 7439-89-6 | 0.000651 | 10599.9990234 | 3388.04370117 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000602 | 9800 | 3133.02954102 | ||||
| Nickel (Ni) | 7440-02-0 | 0.013288 | 216200.015625 | 69155.640625 | ||||
| Silicon (Si) | 7440-21-3 | 0.000037 | 600 | 192.561630249 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.001561 | 25400 | 8124.01904297 | ||||
| Tin (Sn) | 7440-31-5 | 0.002397 | 39000 | 12474.8701172 | ||||
| Lead Frame Total: | 0.061128 | 994600 | 318132.59375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002712 | 1000000 | 14115.7832031 | ||||
| External Plating Total: | 0.002712 | 1000000 | 14115.7832031 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001274 | 1000000 | 6630.36523438 | ||||
| Internal Plating Total: | 0.001274 | 1000000 | 6630.36523438 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000061 | 250000 | 317.466430664 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000184 | 750000 | 957.603759766 | |||||
| Die Attach Total: | 0.000245 | 1000000 | 1275.07019043 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.012573 | 103000 | 65434.5234375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.109253 | 895000 | 568592.8125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000244 | 2000 | 1269.86572266 | ||||
| Encapsulation Total: | 0.122070 | 1000000 | 635297.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.001008 | 1000000 | 5246.00292969 | ||
| TOTAL MASS (g): | 0.192146 | |||||||