LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC221CN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 02:30:53) | TOTAL MASS (g): | 1.020363 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002994 | 1000000 | 2934.24975586 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.313072 | 975000 | 306824.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.007706 | 24000 | 7552.21435547 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000096 | 300 | 94.0841674805 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000225 | 700 | 220.509750366 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.321099 | 1000000 | 314690.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.024547 | 1000000 | 24057.1113281 | ||||
| External Plating Total: | 0.024547 | 1000000 | 24057.1113281 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002569 | 1000000 | 2517.73144531 | ||||
| Internal Plating Total: | 0.002569 | 1000000 | 2517.73144531 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000912 | 750000 | 893.799560547 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000304 | 250000 | 297.933166504 | |||||
| Die Attach Total: | 0.001216 | 1000000 | 1191.73266602 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.160224 | 240000 | 157026.484375 | |||
| Bromine (Br) | 40039-93-8 | 0.006676 | 10000 | 6542.76953125 | ||||
| Silica (SiO2) | 60676-86-0 | 0.480672 | 720000 | 471079.4375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.020028 | 30000 | 19628.3105469 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.667600 | 1000000 | 654276.9375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000338 | 1000000 | 331.254669189 | ||
| TOTAL MASS (g): | 1.020363 | |||||||