LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC2055HVIDD#TRPBF | (Engineering Calculation) | DFN 3mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-16 23:55:19) | TOTAL MASS (g): | 0.022976 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001286 | 1000000 | 55970.53125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.009350 | 975000 | 406939.71875 | ||
| Iron (Fe) | 7439-89-6 | 0.000230 | 24000 | 10010.28125 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000003 | 300 | 130.568893433 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000007 | 700 | 304.660766602 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.009590 | 1000000 | 417385.21875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000437 | 1000000 | 19035.8730469 | ||||
| External Plating Total: | 0.000437 | 1000000 | 19035.8730469 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000218 | 1000000 | 9488.00585938 | ||||
| Internal Plating Total: | 0.000218 | 1000000 | 9488.00585938 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000670 | 750000 | 29160.3867188 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000223 | 250000 | 9705.62109375 | |||||
| Die Attach Total: | 0.000893 | 1000000 | 38866.0039062 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001368 | 130000 | 59539.4179688 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.009047 | 860000 | 393752.25 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000105 | 10000 | 4569.91162109 | ||||
| Encapsulation Total: | 0.010520 | 1000000 | 457861.5625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000032 | 1000000 | 1392.73486328 | ||
| TOTAL MASS (g): | 0.022976 | |||||||