LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC2052HS#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-16 23:53:08) | TOTAL MASS (g): | 0.132407 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001877 | 1000000 | 14175.9404297 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | A42 | Copper (Cu) | 7440-50-8 | 0.000000 | 0 | 0 | ||
| Iron (Fe) | 7439-89-6 | 0.025972 | 580000 | 196152.109375 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.018808 | 420000 | 142046.390625 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.044780 | 1000000 | 338198.5 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002585 | 1000000 | 19526.3769531 | ||||
| External Plating Total: | 0.002585 | 1000000 | 19526.3769531 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000358 | 1000000 | 2703.77539062 | ||||
| Internal Plating Total: | 0.000358 | 1000000 | 2703.77539062 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000658 | 750000 | 4969.50927734 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000219 | 250000 | 1653.9855957 | |||||
| Die Attach Total: | 0.000877 | 1000000 | 6623.49462891 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.010624 | 130000 | 80237.1796875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.067828 | 830000 | 512267.28125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.002860 | 35000 | 21599.9921875 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000409 | 5000 | 3088.95019531 | ||||
| Encapsulation Total: | 0.081721 | 1000000 | 617193.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000209 | 1000000 | 1578.46118164 | ||
| TOTAL MASS (g): | 0.132407 | |||||||