LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC2050HVCS8#TRPBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-16 23:54:39) | TOTAL MASS (g): | 0.07169 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000851 | 1000000 | 11870.5791016 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023653 | 975000 | 329935.125 | ||
| Iron (Fe) | 7439-89-6 | 0.000582 | 24000 | 8118.30419922 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000007 | 300 | 97.6428375244 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000017 | 700 | 237.132598877 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.024259 | 1000000 | 338388.21875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001477 | 1000000 | 20600.5722656 | ||||
| External Plating Total: | 0.001477 | 1000000 | 20600.5722656 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000068 | 1000000 | 948.530395508 | ||||
| Internal Plating Total: | 0.000068 | 1000000 | 948.530395508 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000409 | 750000 | 5705.13134766 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000136 | 250000 | 1897.06079102 | |||||
| Die Attach Total: | 0.000545 | 1000000 | 7602.19189453 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006657 | 150000 | 92858.3359375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036392 | 820000 | 507631.125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001110 | 25000 | 15483.3623047 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000222 | 5000 | 3096.67260742 | ||||
| Encapsulation Total: | 0.044381 | 1000000 | 619069.5 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000109 | 1000000 | 1520.43835449 | ||
| TOTAL MASS (g): | 0.071690 | |||||||