LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1821ACGW#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 10:17:30) | TOTAL MASS (g): | 0.690759 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005648 | 1000000 | 8176.51220703 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.192153 | 975000 | 278176.5625 | ||
| Iron (Fe) | 7439-89-6 | 0.004730 | 24000 | 6847.5390625 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000059 | 300 | 85.4132843018 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000138 | 700 | 199.780212402 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.197080 | 1000000 | 285309.28125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.010584 | 1000000 | 15322.4267578 | ||||
| External Plating Total: | 0.010584 | 1000000 | 15322.4267578 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001577 | 1000000 | 2282.99560547 | ||||
| Internal Plating Total: | 0.001577 | 1000000 | 2282.99560547 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001459 | 750000 | 2112.16894531 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000486 | 250000 | 703.573730469 | |||||
| Die Attach Total: | 0.001945 | 1000000 | 2815.74267578 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.048682 | 103000 | 70476.0859375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.423013 | 895000 | 612388.625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000945 | 2000 | 1368.06018066 | ||||
| Encapsulation Total: | 0.472640 | 1000000 | 684232.6875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.001285 | 1000000 | 1860.2722168 | ||
| TOTAL MASS (g): | 0.690759 | |||||||