LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1742CFW#PBF | (Engineering Calculation) | TSSOP 6.1mm WIDTH | ||||||
| (printed on: 2017-03-17 12:07:47) | TOTAL MASS (g): | 0.179116 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005747 | 1000000 | 32085.3632812 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.065071 | 975000 | 363289.84375 | ||
| Iron (Fe) | 7439-89-6 | 0.001602 | 24000 | 8943.92675781 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000020 | 300 | 111.659507751 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000047 | 700 | 262.399871826 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.066740 | 1000000 | 372607.8125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.004601 | 1000000 | 25687.0585938 | ||||
| External Plating Total: | 0.004601 | 1000000 | 25687.0585938 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000600 | 1000000 | 3349.78540039 | ||||
| Internal Plating Total: | 0.000600 | 1000000 | 3349.78540039 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001428 | 750000 | 7972.48925781 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000476 | 250000 | 2657.49633789 | |||||
| Die Attach Total: | 0.001904 | 1000000 | 10629.9853516 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.015269 | 155000 | 85246.4609375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.082748 | 840000 | 461980.09375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000493 | 5000 | 2752.40722656 | ||||
| Encapsulation Total: | 0.098510 | 1000000 | 549978.9375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.001014 | 1000000 | 5661.13720703 | ||
| TOTAL MASS (g): | 0.179116 | |||||||