LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1664IN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 10:34:23) | TOTAL MASS (g): | 1.021254 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003513 | 1000000 | 3439.88842773 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.313072 | 975000 | 306556.4375 | ||
| Iron (Fe) | 7439-89-6 | 0.007706 | 24000 | 7545.625 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000096 | 300 | 94.0020751953 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000225 | 700 | 220.317367554 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.321099 | 1000000 | 314416.375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.024547 | 1000000 | 24036.1191406 | ||||
| External Plating Total: | 0.024547 | 1000000 | 24036.1191406 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002569 | 1000000 | 2515.53466797 | ||||
| Internal Plating Total: | 0.002569 | 1000000 | 2515.53466797 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001016 | 750000 | 994.855285645 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000339 | 250000 | 331.944824219 | |||||
| Die Attach Total: | 0.001355 | 1000000 | 1326.80004883 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.160224 | 240000 | 156889.46875 | |||
| Bromine (Br) | 40039-93-8 | 0.006676 | 10000 | 6537.06103516 | ||||
| Silica (SiO2) | 60676-86-0 | 0.480672 | 720000 | 470668.375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.020028 | 30000 | 19611.1835938 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.667600 | 1000000 | 653706.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000571 | 1000000 | 559.116455078 | ||
| TOTAL MASS (g): | 1.021254 | |||||||