LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1559CS-3.3#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-17 22:56:05) | TOTAL MASS (g): | 0.157493 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004436 | 1000000 | 28166.3828125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.051070 | 975000 | 324269 | ||
| Iron (Fe) | 7439-89-6 | 0.001257 | 24000 | 7981.32275391 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000016 | 300 | 101.592010498 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000037 | 700 | 234.931533813 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.052380 | 1000000 | 332586.84375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002954 | 1000000 | 18754.5449219 | ||||
| External Plating Total: | 0.002954 | 1000000 | 18754.5449219 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000419 | 1000000 | 2660.44067383 | ||||
| Internal Plating Total: | 0.000419 | 1000000 | 2660.44067383 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001200 | 750000 | 7619.40136719 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000400 | 250000 | 2539.80029297 | |||||
| Die Attach Total: | 0.001600 | 1000000 | 10159.2011719 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.012389 | 130000 | 78663.9609375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.079099 | 830000 | 502239.15625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.003336 | 35000 | 21181.9355469 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000477 | 5000 | 3028.71166992 | ||||
| Encapsulation Total: | 0.095301 | 1000000 | 605113.8125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000403 | 1000000 | 2558.84887695 | ||
| TOTAL MASS (g): | 0.157493 | |||||||