LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LTC1539CGW#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 22:23:51) | TOTAL MASS (g): | 0.692848 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007795 | 1000000 | 11250.6621094 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.192153 | 975000 | 277337.84375 | ||
| Iron (Fe) | 7439-89-6 | 0.004730 | 24000 | 6826.89306641 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000059 | 300 | 85.15574646 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000138 | 700 | 199.177856445 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.197080 | 1000000 | 284449.0625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.010584 | 1000000 | 15276.2275391 | ||||
| External Plating Total: | 0.010584 | 1000000 | 15276.2275391 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001577 | 1000000 | 2276.11206055 | ||||
| Internal Plating Total: | 0.001577 | 1000000 | 2276.11206055 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001809 | 750000 | 2610.96191406 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000603 | 250000 | 870.320617676 | |||||
| Die Attach Total: | 0.002412 | 1000000 | 3481.2824707 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.048682 | 103000 | 70263.59375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.423013 | 895000 | 610542.1875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000945 | 2000 | 1363.93518066 | ||||
| Encapsulation Total: | 0.472640 | 1000000 | 682169.6875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000760 | 1000000 | 1096.92150879 | ||
| TOTAL MASS (g): | 0.692848 | |||||||