LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1458CSW#TRPBF | (Engineering Calculation) | SOIC WIDE | ||||||
| (printed on: 2017-03-17 10:30:00) | TOTAL MASS (g): | 0.756762 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.010223 | 1000000 | 13508.8642578 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.185240 | 975000 | 244779.609375 | ||
| Iron (Fe) | 7439-89-6 | 0.004560 | 24000 | 6025.66894531 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000057 | 300 | 75.3208770752 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000133 | 700 | 175.748687744 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.189990 | 1000000 | 251056.34375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.008359 | 1000000 | 11046.2158203 | ||||
| External Plating Total: | 0.008359 | 1000000 | 11046.2158203 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001513 | 1000000 | 1999.30651855 | ||||
| Internal Plating Total: | 0.001513 | 1000000 | 1999.30651855 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.002201 | 750000 | 2908.44262695 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000734 | 250000 | 969.921325684 | |||||
| Die Attach Total: | 0.002935 | 1000000 | 3878.36401367 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.073286 | 135000 | 96841.4921875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.466860 | 860000 | 616917.5625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.002714 | 5000 | 3586.33056641 | ||||
| Encapsulation Total: | 0.542860 | 1000000 | 717345.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000882 | 1000000 | 1165.49145508 | ||
| TOTAL MASS (g): | 0.756762 | |||||||