LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1440CN8#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-16 21:38:25) | TOTAL MASS (g): | 0.497961 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001358 | 1000000 | 2727.11962891 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000076 | 1000000 | 152.622299194 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.149760 | 975000 | 300746.25 | ||
| Iron (Fe) | 7439-89-6 | 0.003686 | 24000 | 7402.18164062 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000046 | 300 | 92.376663208 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000108 | 700 | 216.884338379 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.153600 | 1000000 | 308457.71875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.012410 | 1000000 | 24922.1992188 | ||||
| External Plating Total: | 0.012410 | 1000000 | 24922.1992188 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001228 | 1000000 | 2466.05541992 | ||||
| Internal Plating Total: | 0.001228 | 1000000 | 2466.05541992 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000533 | 750000 | 1070.36425781 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000178 | 250000 | 357.457519531 | |||||
| Die Attach Total: | 0.000711 | 1000000 | 1427.82177734 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.078790 | 240000 | 158225.15625 | |||
| Bromine (Br) | 40039-93-8 | 0.003283 | 10000 | 6592.88232422 | ||||
| Silica (SiO2) | 60676-86-0 | 0.236370 | 720000 | 474675.4375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.009849 | 30000 | 19778.6464844 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.328292 | 1000000 | 659272.125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000286 | 1000000 | 574.34185791 | ||
| TOTAL MASS (g): | 0.497961 | |||||||