LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1439EG#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 22:21:19) | TOTAL MASS (g): | 0.329479 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007795 | 1000000 | 23658.5566406 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.111592 | 962000 | 338692.21875 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.003480 | 30000 | 10562.1269531 | ||||
| Silicon (Si) | 7440-21-3 | 0.000754 | 6500 | 2288.46069336 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000174 | 1500 | 528.106323242 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.116000 | 1000000 | 352070.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.010584 | 1000000 | 32123.7558594 | ||||
| External Plating Total: | 0.010584 | 1000000 | 32123.7558594 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000928 | 1000000 | 2816.56713867 | ||||
| Internal Plating Total: | 0.000928 | 1000000 | 2816.56713867 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001809 | 750000 | 5490.48535156 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000603 | 250000 | 1830.16149902 | |||||
| Die Attach Total: | 0.002412 | 1000000 | 7320.64599609 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.019673 | 103000 | 59709.3984375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.170945 | 895000 | 518834.125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000382 | 2000 | 1159.40588379 | ||||
| Encapsulation Total: | 0.191000 | 1000000 | 579702.9375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000760 | 1000000 | 2306.67138672 | ||
| TOTAL MASS (g): | 0.329479 | |||||||