LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1391CGN#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 02:31:22) | TOTAL MASS (g): | 0.08001 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001460 | 1000000 | 18247.703125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.029933 | 975000 | 374115.40625 | ||
| Iron (Fe) | 7439-89-6 | 0.000737 | 24000 | 9211.34082031 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000009 | 300 | 112.485847473 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000021 | 700 | 262.466949463 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.030700 | 1000000 | 383701.6875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002272 | 1000000 | 28397.4277344 | ||||
| External Plating Total: | 0.002272 | 1000000 | 28397.4277344 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000246 | 1000000 | 3074.61328125 | ||||
| Internal Plating Total: | 0.000246 | 1000000 | 3074.61328125 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000558 | 750000 | 6974.12207031 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000186 | 250000 | 2324.70727539 | |||||
| Die Attach Total: | 0.000744 | 1000000 | 9298.82910156 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006623 | 150000 | 82777.078125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036203 | 820000 | 452480.5625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001104 | 25000 | 13798.2626953 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000221 | 5000 | 2762.15209961 | ||||
| Encapsulation Total: | 0.044151 | 1000000 | 551818 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000437 | 1000000 | 5461.8125 | ||
| TOTAL MASS (g): | 0.080010 | |||||||