LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1349IG#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 22:24:46) | TOTAL MASS (g): | 0.235133 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.006193 | 1000000 | 26338.2929688 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.122431 | 975000 | 520688.46875 | ||
| Iron (Fe) | 7439-89-6 | 0.003014 | 24000 | 12818.2802734 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000038 | 300 | 161.610702515 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000088 | 700 | 374.256378174 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.125571 | 1000000 | 534042.625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003749 | 1000000 | 15943.8808594 | ||||
| External Plating Total: | 0.003749 | 1000000 | 15943.8808594 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001005 | 1000000 | 4274.17773438 | ||||
| Internal Plating Total: | 0.001005 | 1000000 | 4274.17773438 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001548 | 750000 | 6583.50976562 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000516 | 250000 | 2194.50317383 | |||||
| Die Attach Total: | 0.002064 | 1000000 | 8778.01269531 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.009848 | 103000 | 41882.6914062 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.085571 | 895000 | 363926.0625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000191 | 2000 | 812.30645752 | ||||
| Encapsulation Total: | 0.095610 | 1000000 | 406621.03125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000941 | 1000000 | 4001.99145508 | ||
| TOTAL MASS (g): | 0.235133 | |||||||