LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1334ISW#PBF | (Engineering Calculation) | SOIC WIDE | ||||||
| (printed on: 2017-03-16 18:35:56) | TOTAL MASS (g): | 0.753908 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007884 | 1000000 | 10457.5058594 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.185240 | 975000 | 245706.265625 | ||
| Iron (Fe) | 7439-89-6 | 0.004560 | 24000 | 6048.48046875 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000057 | 300 | 75.606010437 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000133 | 700 | 176.414016724 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.189990 | 1000000 | 252006.765625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.008359 | 1000000 | 11088.0332031 | ||||
| External Plating Total: | 0.008359 | 1000000 | 11088.0332031 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001513 | 1000000 | 2006.87536621 | ||||
| Internal Plating Total: | 0.001513 | 1000000 | 2006.87536621 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001815 | 750000 | 2407.4543457 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000605 | 250000 | 802.484863281 | |||||
| Die Attach Total: | 0.002420 | 1000000 | 3209.93945312 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.073286 | 135000 | 97208.09375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.466860 | 860000 | 619253 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.002714 | 5000 | 3599.90698242 | ||||
| Encapsulation Total: | 0.542860 | 1000000 | 720061 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000882 | 1000000 | 1169.90356445 | ||
| TOTAL MASS (g): | 0.753908 | |||||||