LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1159CG-5#PBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 22:19:33) | TOTAL MASS (g): | 0.149247 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003629 | 1000000 | 24315.453125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.058880 | 975000 | 394514.75 | ||
| Iron (Fe) | 7439-89-6 | 0.001449 | 24000 | 9708.76074219 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000018 | 300 | 120.605728149 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000042 | 700 | 281.413360596 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.060389 | 1000000 | 404625.5 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002831 | 1000000 | 18966.140625 | ||||
| External Plating Total: | 0.002831 | 1000000 | 18966.140625 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000483 | 1000000 | 3236.25366211 | ||||
| Internal Plating Total: | 0.000483 | 1000000 | 3236.25366211 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001040 | 750000 | 6968.33056641 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000347 | 250000 | 2325.01025391 | |||||
| Die Attach Total: | 0.001387 | 1000000 | 9293.34082031 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.012027 | 150000 | 80584.7265625 | |||
| Bromine (Br) | 40039-93-8 | 0.000802 | 10000 | 5373.65478516 | ||||
| Silica (SiO2) | 60676-86-0 | 0.064946 | 810000 | 435158.875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.002405 | 30000 | 16114.2646484 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.080180 | 1000000 | 537231.4375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000348 | 1000000 | 2331.71069336 | ||
| TOTAL MASS (g): | 0.149247 | |||||||