LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1159CG-3.3#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 22:19:39) | TOTAL MASS (g): | 0.147169 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002017 | 1000000 | 13705.3642578 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.058880 | 975000 | 400085.21875 | ||
| Iron (Fe) | 7439-89-6 | 0.001449 | 24000 | 9845.84667969 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000018 | 300 | 122.308654785 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000042 | 700 | 285.386871338 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.060389 | 1000000 | 410338.75 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002831 | 1000000 | 19233.9394531 | ||||
| External Plating Total: | 0.002831 | 1000000 | 19233.9394531 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000483 | 1000000 | 3281.94897461 | ||||
| Internal Plating Total: | 0.000483 | 1000000 | 3281.94897461 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000691 | 750000 | 4695.29345703 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000230 | 250000 | 1562.83288574 | |||||
| Die Attach Total: | 0.000921 | 1000000 | 6258.12646484 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.012027 | 150000 | 81722.5625 | |||
| Bromine (Br) | 40039-93-8 | 0.000802 | 10000 | 5449.53027344 | ||||
| Silica (SiO2) | 60676-86-0 | 0.064946 | 810000 | 441303.25 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.002405 | 30000 | 16341.7939453 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.080180 | 1000000 | 544817.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000348 | 1000000 | 2364.6340332 | ||
| TOTAL MASS (g): | 0.147169 | |||||||