LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1148CS-5#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-17 22:46:44) | TOTAL MASS (g): | 0.139062 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003629 | 1000000 | 26096.1894531 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.047911 | 975000 | 344528.6875 | ||
| Iron (Fe) | 7439-89-6 | 0.001179 | 24000 | 8478.20605469 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000015 | 300 | 107.865203857 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000034 | 700 | 244.494476318 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.049139 | 1000000 | 353359.21875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002585 | 1000000 | 18591.9179688 | ||||
| External Plating Total: | 0.002585 | 1000000 | 18591.9179688 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000393 | 1000000 | 2826.06835938 | ||||
| Internal Plating Total: | 0.000393 | 1000000 | 2826.06835938 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001040 | 750000 | 7478.65429688 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000347 | 250000 | 2495.28198242 | |||||
| Die Attach Total: | 0.001387 | 1000000 | 9973.93554688 | |||||
| Encapsulation | DCPD RESIN | Resin (EP) | 0.008989 | 110000 | 64640.0234375 | |||
| Bromine (Br) | 40039-93-8 | 0.000817 | 10000 | 5875.05859375 | ||||
| Silica (SiO2) | 60676-86-0 | 0.069462 | 850000 | 499502.21875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.002452 | 30000 | 17632.3671875 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.081720 | 1000000 | 587649.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000209 | 1000000 | 1502.921875 | ||
| TOTAL MASS (g): | 0.139062 | |||||||