LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1143CS#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-17 22:26:48) | TOTAL MASS (g): | 0.156473 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003629 | 1000000 | 23192.5429688 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.051070 | 975000 | 326382.8125 | ||
| Iron (Fe) | 7439-89-6 | 0.001257 | 24000 | 8033.35009766 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000016 | 300 | 102.254264832 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000037 | 700 | 236.462997437 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.052380 | 1000000 | 334754.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002954 | 1000000 | 18876.8007812 | ||||
| External Plating Total: | 0.002954 | 1000000 | 18876.8007812 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000419 | 1000000 | 2677.78344727 | ||||
| Internal Plating Total: | 0.000419 | 1000000 | 2677.78344727 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001040 | 750000 | 6646.52685547 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000347 | 250000 | 2217.63916016 | |||||
| Die Attach Total: | 0.001387 | 1000000 | 8864.16601562 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.012389 | 130000 | 79176.75 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.079099 | 830000 | 505513.125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.003336 | 35000 | 21320.0136719 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000477 | 5000 | 3048.45507812 | ||||
| Encapsulation Total: | 0.095301 | 1000000 | 609058.3125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000403 | 1000000 | 2575.52929688 | ||
| TOTAL MASS (g): | 0.156473 | |||||||