LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1098ACN8#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 07:39:03) | TOTAL MASS (g): | 0.499538 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002630 | 1000000 | 5264.86181641 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.149760 | 975000 | 299796.84375 | ||
| Iron (Fe) | 7439-89-6 | 0.003686 | 24000 | 7378.81396484 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000046 | 300 | 92.0850372314 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000108 | 700 | 216.199645996 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.153600 | 1000000 | 307483.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.012410 | 1000000 | 24843.5234375 | ||||
| External Plating Total: | 0.012410 | 1000000 | 24843.5234375 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001228 | 1000000 | 2458.27026367 | ||||
| Internal Plating Total: | 0.001228 | 1000000 | 2458.27026367 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000826 | 750000 | 1653.52685547 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000275 | 250000 | 550.508361816 | |||||
| Die Attach Total: | 0.001101 | 1000000 | 2204.03540039 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.078816 | 240000 | 157777.703125 | |||
| Bromine (Br) | 40039-93-8 | 0.003284 | 10000 | 6574.07080078 | ||||
| Silica (SiO2) | 60676-86-0 | 0.236448 | 720000 | 473333.125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.009852 | 30000 | 19722.2128906 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.328400 | 1000000 | 657407.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000169 | 1000000 | 338.312438965 | ||
| TOTAL MASS (g): | 0.499538 | |||||||