LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1092CN8#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 07:47:45) | TOTAL MASS (g): | 0.506666 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.008350 | 1000000 | 16480.2753906 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.149760 | 975000 | 295579.125 | ||
| Iron (Fe) | 7439-89-6 | 0.003686 | 24000 | 7275.00488281 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000046 | 300 | 90.7895355225 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000108 | 700 | 213.158050537 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.153600 | 1000000 | 303158.125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.012410 | 1000000 | 24494.0136719 | ||||
| External Plating Total: | 0.012410 | 1000000 | 24494.0136719 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001228 | 1000000 | 2423.68603516 | ||||
| Internal Plating Total: | 0.001228 | 1000000 | 2423.68603516 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001882 | 750000 | 3714.4765625 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000627 | 250000 | 1237.50097656 | |||||
| Die Attach Total: | 0.002509 | 1000000 | 4951.97705078 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.078816 | 240000 | 155558 | |||
| Bromine (Br) | 40039-93-8 | 0.003284 | 10000 | 6481.58349609 | ||||
| Silica (SiO2) | 60676-86-0 | 0.236448 | 720000 | 466674.03125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.009852 | 30000 | 19444.75 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.328400 | 1000000 | 648158.3125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000169 | 1000000 | 333.552886963 | ||
| TOTAL MASS (g): | 0.506666 | |||||||