LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1061ACN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-16 20:27:50) | TOTAL MASS (g): | 1.364015 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007035 | 1000000 | 5157.56933594 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000393 | 1000000 | 288.12008667 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.386100 | 975000 | 283061.5 | ||
| Iron (Fe) | 7439-89-6 | 0.009504 | 24000 | 6967.66748047 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000119 | 300 | 87.2424697876 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000277 | 700 | 203.077026367 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.396000 | 1000000 | 290319.5 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.031039 | 1000000 | 22755.2617188 | ||||
| External Plating Total: | 0.031039 | 1000000 | 22755.2617188 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.003168 | 1000000 | 2322.5559082 | ||||
| Internal Plating Total: | 0.003168 | 1000000 | 2322.5559082 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001674 | 750000 | 1227.25976562 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000558 | 250000 | 409.086547852 | |||||
| Die Attach Total: | 0.002232 | 1000000 | 1636.34619141 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.221624 | 240000 | 162479.203125 | |||
| Bromine (Br) | 40039-93-8 | 0.009234 | 10000 | 6769.72265625 | ||||
| Silica (SiO2) | 60676-86-0 | 0.664873 | 720000 | 487438.375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.027703 | 30000 | 20309.9003906 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.923434 | 1000000 | 676997.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000714 | 1000000 | 523.454833984 | ||
| TOTAL MASS (g): | 1.364015 | |||||||