LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC1060CSW#PBF | (Engineering Calculation) | SOIC WIDE | ||||||
| (printed on: 2017-03-16 20:27:22) | TOTAL MASS (g): | 0.542654 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005230 | 1000000 | 9637.82128906 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.153163 | 975000 | 282248.125 | ||
| Iron (Fe) | 7439-89-6 | 0.003770 | 24000 | 6947.33984375 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000047 | 300 | 86.6113967896 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000110 | 700 | 202.70753479 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.157090 | 1000000 | 289484.78125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005974 | 1000000 | 11008.2666016 | ||||
| External Plating Total: | 0.005974 | 1000000 | 11008.2666016 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001257 | 1000000 | 2316.39428711 | ||||
| Internal Plating Total: | 0.001257 | 1000000 | 2316.39428711 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001335 | 750000 | 2460.13232422 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000445 | 250000 | 820.044128418 | |||||
| Die Attach Total: | 0.001780 | 1000000 | 3280.17651367 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.038213 | 103000 | 70418.75 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.332045 | 895000 | 611891.0625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000742 | 2000 | 1367.35437012 | ||||
| Encapsulation Total: | 0.371000 | 1000000 | 683677.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000323 | 1000000 | 595.222961426 | ||
| TOTAL MASS (g): | 0.542654 | |||||||