LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LTC1060CN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-16 20:27:21) | TOTAL MASS (g): | 1.36193 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005230 | 1000000 | 3840.13696289 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.386100 | 975000 | 283494.65625 | ||
| Iron (Fe) | 7439-89-6 | 0.009504 | 24000 | 6978.32958984 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000119 | 300 | 87.3759689331 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000277 | 700 | 203.387786865 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.396000 | 1000000 | 290763.75 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.031039 | 1000000 | 22790.0800781 | ||||
| External Plating Total: | 0.031039 | 1000000 | 22790.0800781 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.003168 | 1000000 | 2326.10986328 | ||||
| Internal Plating Total: | 0.003168 | 1000000 | 2326.10986328 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001335 | 750000 | 980.226318359 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000445 | 250000 | 326.742095947 | |||||
| Die Attach Total: | 0.001780 | 1000000 | 1306.96838379 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.124740 | 135000 | 91590.578125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.794640 | 860000 | 583465.9375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.004620 | 5000 | 3392.2434082 | ||||
| Encapsulation Total: | 0.924000 | 1000000 | 678448.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000714 | 1000000 | 524.255859375 | ||
| TOTAL MASS (g): | 1.361930 | |||||||