LINEAR TECHNOLOGY MATERIALS DECLARATION

LT8610AXMSE#PBF (Engineering Calculation) MSOP-Exposed  
(printed on: 2017-03-17 00:22:47) TOTAL MASS (g): 0.038679
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003306 1000000 85472.6875
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.013845 975000 357945.96875
Iron (Fe) 7439-89-6 0.000341 24000 8816.1484375
Phosphorus (P) 7723-14-0 0.000004 300 103.415229797
Zinc (Zn) 7440-66-6 0.000010 700 258.53805542
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.014200 1000000 367124.09375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000710 1000000 18356.8476562
External Plating Total: 0.000710 1000000 18356.8476562
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000086 1000000 2223.42749023
Internal Plating Total: 0.000086 1000000 2223.42749023
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000986 750000 25491.8554688
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000329 250000 8505.90332031
Die Attach Total: 0.001315 1000000 33997.7539062
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001932 103000 49949.5546875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.016790 895000 434085.46875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000038 2000 982.444641113
Encapsulation Total: 0.018760 1000000 485017.40625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000302 1000000 7807.85009766
  TOTAL MASS (g): 0.038679