LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT8415EDDB#TRMPBF | (Engineering Calculation) | DFN 3mm X 2mm Exp. Pad | ||||||
| (printed on: 2017-03-17 04:26:16) | TOTAL MASS (g): | 0.01375 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000717 | 1000000 | 52146.9492188 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.005090 | 975000 | 370192.4375 | ||
| Iron (Fe) | 7439-89-6 | 0.000125 | 24000 | 9091.17089844 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000002 | 300 | 145.458724976 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000004 | 700 | 290.917449951 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.005221 | 1000000 | 379719.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000185 | 1000000 | 13426.3125 | ||||
| External Plating Total: | 0.000185 | 1000000 | 13426.3125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000103 | 1000000 | 7491.12402344 | ||||
| Internal Plating Total: | 0.000103 | 1000000 | 7491.12402344 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000005 | 50000 | 363.646759033 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000032 | 300000 | 2327.33959961 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000069 | 650000 | 5018.32568359 | |||||
| Die Attach Total: | 0.000106 | 1000000 | 7709.31201172 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000958 | 130000 | 69674.7265625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006338 | 860000 | 460958.65625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000074 | 10000 | 5381.97265625 | ||||
| Encapsulation Total: | 0.007370 | 1000000 | 536015.3125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000048 | 1000000 | 3491.00927734 | ||
| TOTAL MASS (g): | 0.013750 | |||||||