LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT6558IDHC#TRPBF | (Engineering Calculation) | DFN 5mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-17 00:00:53) | TOTAL MASS (g): | 0.038486 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001271 | 1000000 | 33024.9960938 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.017069 | 974800.0625 | 443511.9375 | ||
| Iron (Fe) | 7439-89-6 | 0.000411 | 23500 | 10679.2080078 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000015 | 850 | 389.752105713 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000015 | 850 | 389.752105713 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.017510 | 1000000 | 454970.65625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000817 | 1000000 | 21228.5546875 | ||||
| External Plating Total: | 0.000817 | 1000000 | 21228.5546875 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000391 | 1000000 | 10159.5390625 | ||||
| Internal Plating Total: | 0.000391 | 1000000 | 10159.5390625 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000675 | 750000 | 17538.8457031 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000225 | 250000 | 5846.28173828 | |||||
| Die Attach Total: | 0.000900 | 1000000 | 23385.1269531 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002274 | 130000 | 59086.421875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.015041 | 860000 | 390817.4375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000175 | 10000 | 4547.10791016 | ||||
| Encapsulation Total: | 0.017490 | 1000000 | 454450.96875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000107 | 1000000 | 2780.23168945 | ||
| TOTAL MASS (g): | 0.038486 | |||||||