LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT6236HS6#TRMPBF | (Engineering Calculation) | TSOT-23 | ||||||
| (printed on: 2017-03-16 17:12:15) | TOTAL MASS (g): | 0.012619 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000602 | 1000000 | 47706.7578125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.004582 | 975000 | 363110.25 | ||
| Iron (Fe) | 7439-89-6 | 0.000113 | 24000 | 8954.92382812 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 79.2471084595 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000003 | 700 | 237.741333008 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.004699 | 1000000 | 372382.15625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000644 | 1000000 | 51015.8007812 | ||||
| External Plating Total: | 0.000644 | 1000000 | 51015.8007812 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000080 | 1000000 | 6339.76855469 | ||||
| Internal Plating Total: | 0.000080 | 1000000 | 6339.76855469 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000440 | 750000 | 34868.7265625 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000147 | 250000 | 11649.3242188 | |||||
| Die Attach Total: | 0.000587 | 1000000 | 46518.0546875 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000772 | 130000 | 61178.7695312 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.004930 | 830000 | 390688.25 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000208 | 35000 | 16483.3984375 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000030 | 5000 | 2377.41333008 | ||||
| Encapsulation Total: | 0.005940 | 1000000 | 470727.84375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000067 | 1000000 | 5309.55615234 | ||
| TOTAL MASS (g): | 0.012619 | |||||||