LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT6018IS8E#TRPBF | (Engineering Calculation) | SOIC Exposed Pad | ||||||
| (printed on: 2017-03-17 00:32:24) | TOTAL MASS (g): | 0.075893 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004650 | 1000000 | 61270.546875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023398 | 964450 | 308302.84375 | ||
| Iron (Fe) | 7439-89-6 | 0.000547 | 22560 | 7207.52392578 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 240 | 79.0587692261 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000030 | 1250 | 395.29385376 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000279 | 11500 | 3676.23266602 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.024260 | 1000000 | 319660.9375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001920 | 1000000 | 25297.5898438 | ||||
| External Plating Total: | 0.001920 | 1000000 | 25297.5898438 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000300 | 1000000 | 3952.93847656 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000000 | 0 | 0 | ||||
| Internal Plating Total: | 0.000300 | 1000000 | 3952.93847656 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000014 | 50000 | 184.470474243 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000082 | 300000 | 1080.46984863 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000178 | 650000 | 2345.41015625 | |||||
| Die Attach Total: | 0.000274 | 1000000 | 3610.35009766 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004571 | 103000 | 60229.6054688 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.039720 | 895000 | 523369 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000089 | 2000 | 1172.70507812 | ||||
| Encapsulation Total: | 0.044380 | 1000000 | 584771.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000109 | 1000000 | 1436.234375 | ||
| TOTAL MASS (g): | 0.075893 | |||||||