LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT6018HDE#TRPBF | (Engineering Calculation) | DFN-FCOL 4mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-17 00:32:26) | TOTAL MASS (g): | 0.013547 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003100 | 1000000 | 228827.46875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.002935 | 975000 | 216647.9375 | ||
| Iron (Fe) | 7439-89-6 | 0.000072 | 24000 | 5314.70263672 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 73.8153076172 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000002 | 700 | 147.630615234 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.003010 | 1000000 | 222184.09375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000136 | 1000000 | 10062.8574219 | ||||
| External Plating Total: | 0.000136 | 1000000 | 10062.8574219 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000072 | 1000000 | 5314.70263672 | ||||
| Internal Plating Total: | 0.000072 | 1000000 | 5314.70263672 | |||||
| Die Attach | SnAg Cap | Silver (Ag) | 7440-22-4 | 0.000040 | 20000 | 2952.61254883 | ||
| Tin (Sn) | 7440-31-5 | 0.001979 | 980000 | 146080.5 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.002019 | 1000000 | 149033.109375 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000677 | 130000 | 49972.9648438 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.004481 | 860000 | 330766.40625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000052 | 10000 | 3838.39624023 | ||||
| Encapsulation Total: | 0.005210 | 1000000 | 384577.78125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000000 | 0 | 0 | ||
| TOTAL MASS (g): | 0.013547 | |||||||