LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT5581IDDB#TRMPBF | (Engineering Calculation) | DFN 3mm X 2mm Exp. Pad | ||||||
| (printed on: 2017-03-16 22:51:28) | TOTAL MASS (g): | 0.013196 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000518 | 1000000 | 39255.4882812 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.004211 | 974800.0625 | 319121.375 | ||
| Iron (Fe) | 7439-89-6 | 0.000102 | 23500 | 7729.84521484 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 850 | 303.131164551 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000004 | 850 | 303.131164551 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.004321 | 1000000 | 327457.46875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000185 | 1000000 | 13989.9970703 | ||||
| External Plating Total: | 0.000185 | 1000000 | 13989.9970703 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000103 | 1000000 | 7805.62792969 | ||||
| Internal Plating Total: | 0.000103 | 1000000 | 7805.62792969 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000009 | 100000 | 682.045166016 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000026 | 300000 | 1970.35266113 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000051 | 600000 | 3864.92260742 | |||||
| Die Attach Total: | 0.000086 | 1000000 | 6517.3203125 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001034 | 130000 | 78359.4140625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006837 | 860000 | 518127.03125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000080 | 10000 | 6062.62353516 | ||||
| Encapsulation Total: | 0.007951 | 1000000 | 602549 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000032 | 1000000 | 2425.04931641 | ||
| TOTAL MASS (g): | 0.013196 | |||||||