LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LT5502EGN#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-16 19:40:59) | TOTAL MASS (g): | 0.14291 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002149 | 1000000 | 15037.4785156 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.058949 | 975000 | 412491.53125 | ||
| Iron (Fe) | 7439-89-6 | 0.001451 | 24000 | 10153.2714844 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000018 | 300 | 125.95375061 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000042 | 700 | 293.892089844 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.060460 | 1000000 | 423064.65625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003400 | 1000000 | 23788.4628906 | ||||
| External Plating Total: | 0.003400 | 1000000 | 23788.4628906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000484 | 1000000 | 3386.75610352 | ||||
| Internal Plating Total: | 0.000484 | 1000000 | 3386.75610352 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000720 | 750000 | 5038.14990234 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000240 | 250000 | 1679.38317871 | |||||
| Die Attach Total: | 0.000960 | 1000000 | 6717.53271484 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.007726 | 103000 | 54062.1523438 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.067134 | 895000 | 469765.5 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000150 | 2000 | 1049.61462402 | ||||
| Encapsulation Total: | 0.075010 | 1000000 | 524877.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000447 | 1000000 | 3127.8515625 | ||
| TOTAL MASS (g): | 0.142910 | |||||||