LINEAR TECHNOLOGY MATERIALS DECLARATION

LT4356MPS-1 (Engineering Calculation) SOIC  
(printed on: 2017-03-17 03:33:57) TOTAL MASS (g): 0.154823005199
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002216 1000000 14313
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.051070 975000 329861
Iron (Fe) 7439-89-6 0.001257 24000 8119
Phosphorus (P) 7723-14-0 0.000016 300 103
Zinc (Zn) 7440-66-6 0.000037 700 239
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.052380 1000000 338322
Plating PMI Exter. Plating Pb 7439-92-1 0.000468 150000 3023
Exter. Plating Sn 7440-31-5 0.002652 850000 17129
External Plating Total: 0.003120 1000000 20152
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000419 1000000 2706
Internal Plating Total: 0.000419 1000000 2706
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000738 750000 4767
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000246 250000 1589
Die Attach Total: 0.000984 1000000 6356
Encapsulation MULTI-AROMATIC RESIN Br/Sb Free Resin (EP)   0.009816 103000 63401
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.085294 895000 550913
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000191 2000 1234
Encapsulation Total: 0.095301 1000000 615548
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000403 1000000 2603
  TOTAL MASS (g): 0.154823