LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT4356HDE-2#PBF | (Engineering Calculation) | DFN 4mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-16 21:49:32) | TOTAL MASS (g): | 0.031075 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001477 | 1000000 | 47530.421875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.012783 | 975000 | 411361.8125 | ||
| Iron (Fe) | 7439-89-6 | 0.000315 | 24000 | 10136.8203125 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 300 | 128.721511841 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000009 | 700 | 289.623413086 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.013111 | 1000000 | 421916.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000607 | 1000000 | 19528.1699219 | ||||
| External Plating Total: | 0.000607 | 1000000 | 19528.1699219 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000295 | 1000000 | 9493.21191406 | ||||
| Internal Plating Total: | 0.000295 | 1000000 | 9493.21191406 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000738 | 750000 | 23749.1210938 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000246 | 250000 | 7916.37402344 | |||||
| Die Attach Total: | 0.000984 | 1000000 | 31665.4960938 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.001597 | 110000 | 51392.0664062 | |||
| Bromine (Br) | 40039-93-8 | 0.000145 | 10000 | 4666.15527344 | ||||
| Silica (SiO2) | 60676-86-0 | 0.012342 | 850000 | 397170.28125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000436 | 30000 | 14030.6455078 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.014520 | 1000000 | 467259.09375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000081 | 1000000 | 2606.61083984 | ||
| TOTAL MASS (g): | 0.031075 | |||||||