LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT4256-3CGN#TRPBF | (Engineering Calculation) | SSOP | ||||||
| (printed on: 2017-03-17 11:37:01) | TOTAL MASS (g): | 0.082648 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003629 | 1000000 | 43909.0664062 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.029933 | 975000 | 362174.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000737 | 24000 | 8917.328125 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000009 | 300 | 108.895462036 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000021 | 700 | 254.089385986 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.030700 | 1000000 | 371454.5 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002272 | 1000000 | 27491.0234375 | ||||
| External Plating Total: | 0.002272 | 1000000 | 27491.0234375 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000246 | 1000000 | 2976.47607422 | ||||
| Internal Plating Total: | 0.000246 | 1000000 | 2976.47607422 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001043 | 750000 | 12619.7734375 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000348 | 250000 | 4210.62451172 | |||||
| Die Attach Total: | 0.001391 | 1000000 | 16830.3984375 | |||||
| Encapsulation | DCPD RESIN | Resin (EP) | 0.004857 | 110000 | 58767.2460938 | |||
| Bromine (Br) | 40039-93-8 | 0.000442 | 10000 | 5347.97705078 | ||||
| Silica (SiO2) | 60676-86-0 | 0.037528 | 850000 | 454069.84375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.001325 | 30000 | 16031.8310547 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.044152 | 1000000 | 534216.875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000258 | 1000000 | 3121.66967773 | ||
| TOTAL MASS (g): | 0.082648 | |||||||