LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3980IDE#TRPBF (Engineering Calculation) DFN 4mm X 3mm Exp. Pad  
(printed on: 2017-03-17 03:44:13) TOTAL MASS (g): 0.03167
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.001678 1000000 52984.28125
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.013133 975000 414685.65625
Iron (Fe) 7439-89-6 0.000323 24000 10199
Phosphorus (P) 7723-14-0 0.000004 300 126.303405762
Zinc (Zn) 7440-66-6 0.000009 700 284.18270874
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.013469 1000000 425295.1875
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000626 1000000 19759.1816406
External Plating Total: 0.000626 1000000 19759.1816406
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000302 1000000 9535.90820312
Internal Plating Total: 0.000302 1000000 9535.90820312
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000803 750000 25355.4101562
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000268 250000 8462.328125
Die Attach Total: 0.001071 1000000 33817.7382812
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001876 130000 59236.3007812
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.012410 860000 391856.34375
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000144 10000 4546.92333984
Encapsulation Total: 0.014430 1000000 455639.5625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000094 1000000 2968.13037109
  TOTAL MASS (g): 0.031670