LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT3957AEUHE#PBF | (Engineering Calculation) | QFN 5mm X 6mm Exp. Pad | ||||||
| (printed on: 2017-03-17 03:45:26) | TOTAL MASS (g): | 0.067396 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000807 | 1000000 | 11973.9775391 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.025794 | 975000 | 382722.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.000635 | 24000 | 9421.90332031 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000008 | 300 | 118.701141357 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000019 | 700 | 281.915222168 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.026456 | 1000000 | 392544.6875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001276 | 1000000 | 18935.0820312 | ||||
| External Plating Total: | 0.001276 | 1000000 | 18935.0820312 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000573 | 1000000 | 8501.96972656 | ||||
| Internal Plating Total: | 0.000573 | 1000000 | 8501.96972656 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000499 | 750000 | 7403.984375 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000166 | 250000 | 2463.04882812 | |||||
| Die Attach Total: | 0.000665 | 1000000 | 9867.03320312 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004876 | 130000 | 72348.3515625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.032257 | 860000 | 478617.875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000375 | 10000 | 5564.11621094 | ||||
| Encapsulation Total: | 0.037508 | 1000000 | 556530.3125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000111 | 1000000 | 1646.97839355 | ||
| TOTAL MASS (g): | 0.067396 | |||||||