LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT3757MPMSE#TR | (Engineering Calculation) | MSOP-Exposed | ||||||
| (printed on: 2017-03-16 19:28:34) | TOTAL MASS (g): | 0.026283999905 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001210 | 1000000 | 46036 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.010433 | 975000 | 396933 | ||
| Iron (Fe) | 7439-89-6 | 0.000257 | 24000 | 9778 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000003 | 300 | 114 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000007 | 700 | 266 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.010700 | 1000000 | 407091 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000112 | 149333 | 4261 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000638 | 850667 | 24273 | ||||
| External Plating Total: | 0.000750 | 1000000 | 28534 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 3272 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 3272 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000499 | 750000 | 18985 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000166 | 250000 | 6316 | |||||
| Die Attach Total: | 0.000665 | 1000000 | 25301 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001659 | 130000 | 63118 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.010591 | 830000 | 402945 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000447 | 35000 | 17007 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000064 | 5000 | 2435 | ||||
| Encapsulation Total: | 0.012761 | 1000000 | 485505 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000112 | 1000000 | 4261 | ||
| TOTAL MASS (g): | 0.026284 | |||||||